AMAOE Tin Plating Tool, Model:A19 Pro Lower Half-Engraving

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards. 2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment. 3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering. 4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls. 5. Suitable for high-volume chip refurbishment in repair shops. 6. Compact desktop design, for mobile phone repair shops and repair labs.